EBNER HOT STAMPING WITH TTP TECHNOLOGY
Due to ever-stronger calls for the active reduction of emissions in automotive manufacturing, all industrial machinery suppliers have been called on to make a contribution.
EBNER PACC technology provides a cost-effective solution for the production of hot-formed components with individually-tailored properties. With EBNER’s years of experience in the field of press hardening as a starting point, PACC technology has now been developed even further to make it capable of meeting the future requirements of the market.
The greatest potential for weight savings can be found in the manufacture of large sidewall components that are heat treated individually, as this reduces the overall number of parts. One of the most important steps during TTP hot forming process is the creation of a precisely defined temperature profile within the blank, which must be heated in a manner that will meet the crash behavior requirements specified by the customer. All requirements for rapid, even heating of the blank must be fulfilled, even as the PH facility provides both the greatest possible economy and the greatest possible throughput (t/h).
EBNER has proven its ability to offer solutions that implement individual customer requests, meet exact strength specifications and provide flexible component designs.
A VISIT TO THE EBNER LAB
The second day of the event offered deeper technological insights at three different locations: voestalpine PHS, voestalpine Stahl and EBNER Industrieofenbau. Shuttles were provided to transport more than 60 participants between the locations.
At EBNER, two stations – one with steel and the other with aluminum as a theme – could be visited, at which the following simulations were presented:
- EBNER HotForm & ITL hot forming of aluminum blanks
- Pressing retrofits
- TTP/PACC simulation PHS
- Contact-free temperature measurement of metallic surfaces
- 3MA measurement of steel parts
- SimCAL test
LESSONS LEARNED
The first executive summit was not just an excellent opportunity to network and reinforce partnerships. It also provided a venue at which the future of mobility could be discussed in terms of the opportunities and chances it offers, and at which the most innovative developments could be benchmarked.